Materials
Stocked. Tested. Ready to build.
A full range of substrates from standard FR-4 through RF-grade Rogers, polyimide flex, and metal-core laminates — all RoHS-compliant and traceable.
Standard FR-4
General PurposeIndustry-standard glass-reinforced epoxy laminate. Tg 130–140°C. Great for most digital and analog designs.
High-Tg & Halogen-Free
Thermal PerformanceTg 170–180°C laminates for lead-free assembly, multiple reflow cycles, and harsh thermal environments.
RF / Microwave
High FrequencyLow-Dk, low-Df laminates for RF, microwave, and high-speed digital. Tight Dk tolerance for impedance control.
Polyimide & Flex
Flexible CircuitsPolyimide films and flex laminates for rigid-flex, high-temperature, and dynamic flexing applications.
Metal Core
Thermal DissipationAluminum and copper-core laminates with thermally conductive dielectric for LED and power electronics.
Heavy Copper
High CurrentCopper weights from 2 oz up to 10 oz on inner and outer layers for power distribution and motor control.
Surface Finishes
Finishes for every assembly process.
- ENIG (Electroless Nickel Immersion Gold)
- ENEPIG
- HASL — Lead-Free
- HASL — Tin-Lead
- OSP (Organic Solderability Preservative)
- Immersion Silver
- Immersion Tin
- Hard Gold (Edge Connectors)
- Selective Hard Gold + ENIG

Hard Gold · ENIG · ENEPIG
Solder Mask Colors
LPI mask in any color you need.

Silkscreen available in white, black and yellow. Specialty masks (peelable, carbon, etc.) on request.